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St. Louis Catholic High School Temporary Campus Improvements
For the Diocese of Lake Charles
 
1620 Bank Street
Lake Charles, 70601
 
Champeaux Evans Hotard Architects, APAC
702 Dr. Michael DeBakey Drive
Lake Charles, La. 70601
 
 
Sealed Bids will be received until 2:00pm on Thursday, May 18, 2023.
Electronic Bids must be submitted through centralauctionhouse.com 
 
Electronic copies of the Contract Documents may be obtained at centralauctionhouse.com
 
A Bid Bond will be required.
 
A “Performance and Payment Bond” will be required to be executed in conjunction with the Contract in the amount of 5% of the Base Bid.  The Performance and Payment Bond shall be issued by an AAA rated insurance company.
 
Builder’s Risk Insurance shall be the responsibility of the Contractor.
 
The Contract Agreement will be executed utilizing AIA Document A101 - 2017 "Standard Form Of Agreement Between Owner and Contractor where the basis of payment is a Stipulated Sum".  A copy has been provided within the specifications booklet.
 
The Contract Time, based on calendar days, will be sixty (90) days.  A written “Notice to Proceed” will be issued by the Architect to begin the Contract Time and will stipulate the Contract Completion Date.  Liquidated damages will be assessed in the amount of $500.00 for every calendar day beyond the stipulated Contract Completion Date.
 
Bids may be held by the Owner for a period not to exceed thirty (30) days from the bid date for the purpose of reviewing the bids and investigating the qualifications of Bidders, prior to award of the Contract.
 
Any questions regarding the bidding documents shall be made to Stephen Hotard of Champeaux Evans Hotard, APAC by way of email. Please submit these questions to the following email address:
 
To: [email protected]
 
It is the intent that all question be answered timely, via a formally issued Addendum, to be distributed to all General Contractors.
 
A Non-Mandatory Pre-Bid Conference will be held at the site on Wednesday, May 3rd, 2023 at 3:30 pm.
 
 
* END OF INVITATION TO BID *